Apple is often the first to the starting line when it comes to shrinking silicon, and its partnership with TSMC is a key reason behind that lead. While we are currently settling into the 2nm era, the roadmap for what comes next is already coming into focus. A new report reveals TSMC is eyeing the sub-1nm milestone with a target for trial production as early as 2029.
TSMC’s silicon roadmap leading to sub-1nm chips
According to DigiTimes, the move to sub-1nm won’t be a single leap. Following the successful start of 2nm mass production late last year, TSMC is already looking toward its next milestone. The foundry plans to move to the 1.4nm node in 2028, which is said to deliver 15 percent improved performance and 30 percent better power efficiency.
The sub-1nm process will arrive next, with TSMC already readying its Tainan A10 facility and its P1-P4 plants for this transition. The company has reportedly set an initial goal of 5,000 wafers per month during the 2029 trial phase. For Apple, this means the potential for chips with unmatched transistor density to power iPhones and Macs of the early 2030s.
Why this matters
The push toward sub-1nm is less about marketing and more about meeting the demands of next-gen computing. As software and on-device AI continue to become more resource-intensive, these nodes will be essential for the growing performance needs without sacrificing battery life.
However, sub-1nm chips could bring their own set of challenges. With yields remaining a constant challenge, even for TSMC’s 2nm process, and manufacturing costs expected to stay high, these cutting-edge SoCs will likely be reserved for Ultra-tier flagships for the foreseeable future. And while the chips may get smaller, the price tags for top-end devices will likely continue to go in the opposite direction.